HomeMarkets Markets Intel looks beyond silicon, outlines breakthroughs in atomically-thin 2D transistors, chip packaging, and interconnects at IEDM 2024 By news December 7, 2024 0 148 FacebookTwitterPinterestWhatsApp Today, the Intel Foundry Technology Research team announced technology breakthroughs in transistor, interconnects, and packaging technology, among …This post was originally published on this site Share FacebookTwitterPinterestWhatsApp Subscribe Login Notify of new follow-up comments new replies to my comments Please login to comment 0 Comments Inline Feedbacks View all comments Stay Connected156,394FansLike396,312FollowersFollow2,330SubscribersSubscribe Latest Articles News FBI director guides the agency in confronting complex international threats, investigating federal crimes and running 55 field offices Market News CEOs and companies are breaking out their wallets for Trump, from Sam Altman to Jeff Bezos and Mark Zuckerberg Markets How Claude Became Tech Insiders’ Chatbot of Choice Top Trades Top Trade Alert – December 13, 2024 – Pfizer (PFE) Markets Friday the 13th – 11 Shopping Days Until Christmas Markets US role in Syria is unclear in wake of Assad’s fall from power News What the US Supreme Court will consider when it rules on gender-affirming care for trans children Biotech How BioNTech’s “revolutionary” lung cancer vaccine actually works Markets False Narrative Thursday – Marjorie Taylor Green and the United States Postal Service Market News European Central Bank likely to cut rates while weighing US trade concerns and France’s chaos News Wray’s departure will cement Trump’s control over the institutions of US justice News Syria Breakdown: What Led Them to This? News Why the Russians Need Georgia and the Caucasus Market News Tech billionaires prepare to invade the Pentagon Load more